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A typical thermoelectric module is shown left. The module consists of pairs of "p-type" and "n-type" semiconductor thermo elements forming thermocouples which are connected electrically in series and thermally in parallel.
 * In Cooling Mode: An electrical DC voltage is supplied to the module. Heat is then pumped from one side to the other (Peltier Effect). The result is that one side of the module becomes cold in an insulated environment. The other side becomes hot which then requires a cooling system to maintain the DT (Delta Temperature). The better the cooling system, the lower the cold side temperature. Bi2Te3 is the foundation material of all thermoelectric generator modules and thermoelectric cooling materials.
- Tec modules are constructed of lower temperature melting materials

- Tec modules use PVC Insulated (90°C) thicker gauge wire to carry current from a power source to the modules, not the case in Seebeck modules
- Faces are never slit.
- No Graphite is used for thermal conductivity.
- Modules are not lapped (ground flat  to make them all the same thickness) for general stock modules unless specified by a client for a custom order!
- Typically are standard 127, 71, 31 couple prefixec in the part number!

ie. TEC1-12706
which means 127 couples
                           6 amp element
size:                 40 x 40 mm standard
 * In Generating Mode: A temperature gradient is maintained across the module called DT (Delta Temperature). A portion of the heat flux (heat flow) passing through the module is converted into electrical power (Seebeck Effect). The rest of the heat is taken away by a cooling system. Seebeck Thermoelectric power modules are engineered with specific features that allow them to survive large temperature stresses and differentials. Peltier modules or cooling modules have none of these features making them inappropriate for thermoelectric power generation, especially when temperatures on the hot side exceed the material used to bond all the parts which make up the modules construction! The major issue is it is virtually impossible to tell the difference between a Seebeck and Peltier modules. But internally their are major differences.
-Element size is much larger in a Seebeck effect module than a   peltier module.
- Seebeck modules are constructed using Teflon insulated wire with a thinner gauge conductor as each TEG modules can only produce a very small amount of power.
- The ceramic face of the Thermoelectric module on the cold side is slit to relieve the enormous stresses placed on the module during operation and Graphite is sometimes applied in lieu of thermal grease as Graphite is able to withstand the high temperatures 650°F and is stable over significantly longer periods of time as grease will dry out and lose it's thermal conductive properties.
- Hot side bonding materials used to construct the module are able to withstand much higher temperatures compared to lower temperature solders that are used to construct a peltier device.
- TEG modules are lapped or polished to the same thickness to allow for a uniform thickness when multiple modules are placed on the same surface which is commonly done with Seebeck TEG modules to generate higher power outputs. This is typically not the case in Peltier modules so no lapping is performed during the manufacturing process unless specified by  the customer. Therefore when multiple peltier modules are assembled on a single surface, some make thermal contact (thicker modules) while the others make very little contact causing the entire system to generate substantially less power then possible!   
-TEG module part numbers  made of Bi2TE3
1.TEG1 or TEG2  
 2.126, 70, 30 couples
  3. 1 less couple designed to accept a lead wire which is bonded on the cold side to protect bonding material from the heat!   
CMO Calcium Manganese Oxide modules are now available as well as CMO Cascade modules. These are the Highest temperature Commercial modules available today. Hot side up to 800°C
 PLEASE CLICK ON VIDEOS BELOW FOR ENGINEERED DIFFERENCES:
Part 1:

Part 2:

Best to least effective thermoelectric TEG power cooling methods:
- Static liquid (pot of water)!!
- Heat sink with air flow. (FAN)
- Heat sink natural convection.
- Flat plate least effective very poor design!

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